Startups & VC

NASA-linked, MIT-trained founders' nSWX raises US$2M for AI chip packaging

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NanoSkunkWorkX (nSWX), a Malaysian startup founded by NASA and MIT alumni, has secured $2 million in seed funding to develop thin-film interfaces for AI chip packaging. This technology aims to enhance heat dissipation and electrical conductivity in dense chip packages without requiring new manufacturing processes, addressing critical challenges in semiconductor efficiency and thermal management. Investors are watching nSWX's progress towards qualifying its graphene-copper films within established supply chains.

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